- Products
- PowerArtistRTL Design-for-Power: Power Reduction, Analysis, and Debug
- RedHawkSoC Power Integrity: Dynamic Power, Advanced Low Power, Reliability, and Chip-Package Co-design
- TotemAnalog Power, Noise and Reliability: Dynamic Power, Substrate Noise, EM, and ESD
- SentinelChip-Package-System Convergence: Power/Signal Integrity, IO-SSO, Thermal, and EMI
- Flows
- RTL to SiliconRTL power reduction, analysis, and signoff
- Analog to DigitalFull-chip mixed-signal power, noise, and reliability
- Chip-Package-SystemChip, package, system co-design / co-analysis
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Totem
HIGHLIGHTS
ESD Robustness Verification for System-on-a-Chip Designs
Apache’s Power and Noise Products Adopted by MoSys for IP Validation and Sign-off
Apache Introduces PathFinder, the Industry’s First ESD Integrity Solution
Apache’s Totem-SE Named as a Finalist in EDN’s 20th Annual Innovations Awards
Aptina Adopts Apache’s Power and Noise Platforms
Realtek Semiconductor Adopts Apache’s Products for Power and Reliability Signoff
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Totem is a full-chip noise integrity platform for analog and mixed-signal designs. It addresses the challenges associated with global couplings of power/ground noise, substrate noise, and package/PCB capacitive and inductive noise for analog, mixed-signal, memory, and high-speed I/O designs. Totem considers the impact of full-chip SoC substrate noise (SE) by directly interfacing with RedHawk to obtain accurate substrate injection signature for all digital components. Totem accurately analyzes noise coupling effects at every time-point using a single kernel solver, enabling designers to account for all global noise impact on their design.
Integrated with existing analog design environment, Totem is a full-chip layout driven analysis solution providing cross-probing of analysis results with industry standard circuit design tools. Designers can use Totem for early-stage prototyping to guide their power network and package design, as well as for accurate chip sign-off.





