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- SentinelChip-Package-System Power/Signal Integrity, IO-SSO, Thermal, and EMI
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Apache Customers Share their Design Experiences At DAC Booth #1813
Topics include ultra low power, 32/28nm designs, substrate noise coupling, ESD, SSO & more from AMD, Aptina, Cienna, LSI, Nvidia, NXP, Renesas, Samsung, and ST
Apache Releases Fourth-Generation RedHawk for Sub-20 Nanometer Power Sign-Off
Delivering greater accuracy, capacity and usability for full-chip dynamic power and reliability simulation
A Modeling Approach for Power Integrity Simulation in 3D-IC Designs
Joint article by Texas Instruments and Apache
‘Early and accurate’ power analysis: myth or reality?
Innovation poses new challenges for electronic systems. To address these challenges, power related design decisions are being made throughout the product development cycle.
In The News
May
7
Design for Reliability – The Golden Age of Simulation Driven ... - EETimes Design
May
1
Apache Updates Redhawk for Sub-20nm and 3-D Designs - EETimes
Apr
30
Understanding Power Integrity as a System-Wide Challenge - Electronic Design
Apr
27
A Modeling Approach for Power Integrity Simulation in 3D-IC Designs - EETimes Design
Apr
25
Globalpress Summit: Apache Roaming New Hunting Grounds - ElectronicsWeekly.com
Event Calendar
Spotlight
Reliability Verification For Smart ICs
The electronic brains behind today’s advanced systems are smart ICs, paving the way for consumer electronics, energy, biomedical, automotive and avionics industries. Power efficiency and system integration are keys to the success of these smart systems. More >
Watch the Reliability Webcast
Design for Reliability - An IC Perspective
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